Photovoltaic module

ABSTRACT

A photovoltaic module capable of suppressing separation of a tab electrode can be obtained. The photovoltaic module includes a plurality of semiconductor layers including a photoelectric conversion layer, a plurality of photovoltaic elements including a finger electrode for collecting generated currents, formed on the semiconductor layers on a side of a light receiving surface, and a tab electrode for electrically connecting the plurality of photovoltaic elements, in which the tab electrode is electrically connected to the finger electrode in a region corresponding to a power generation region of the photovoltaic element and bonded on the light receiving surface through an insulating bonding material.

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to a photovoltaic module, and moreparticularly, it relates to a photovoltaic module including a pluralityof photovoltaic elements.

Description of the Background Art

A photovoltaic module in which a plurality of photovoltaic elements areserially connected with each other is known in general, as disclosed inJapanese Patent Laying-Open No 10-65192 (1998), for example.

Each photovoltaic element constituting the conventional photovoltaicmodule disclosed in the aforementioned Japanese Patent Laying-Open No10-65192 includes a finger electrode consisting of a metallic wire forcollecting generated currents, bonded to a element surface through aconductive adhesive, and a bus bar electrode consisting of foil or ametallic wire for aggregating currents collected by the finger electrodeconsisting of a metallic wire. The bus bar electrode of the conventionalphotovoltaic element is so bonded to a surface of a non-light emittingregion other than a light emitting region of the photovoltaic element asto be electrically connected to the finger electrode.

In the photovoltaic module disclosed in the aforementioned JapanesePatent Laying-Open No 10-65192, the metallic wire is employed as thefinger electrode, and hence the conductive adhesive for bonding thefinger electrode and the element surface must be disadvantageouslyprovided independently of the finger electrode.

On the other hand, a photovoltaic element in which a finger electrodeand a bus bar electrode are formed of conductive paste has been proposedin general. In a case where a photovoltaic module is formed from theconventional photovoltaic elements, a tab electrode consisting of foilis bonded on the bus bar electrode formed of the conductive paste of thephotovoltaic elements adjacent to each other by soldering, whereby thephotovoltaic elements are serially connected with each other. In a casewhere this finger electrode formed of the conductive paste is employed,the conductive paste has an adhesion function, and hence an adhesive forbonding the finger electrode and the element surface is not required tobe provided dissimilarly to a case where the finger electrode consistingof the metallic wire is employed.

In the aforementioned conventional photovoltaic module in which thefinger electrode and the bus bar electrode are formed of the conductivepaste and the tab electrode consisting of foil is formed on the bus barelectrode, however, in a case where an excessive tensile stress isapplied to the bus bar electrode through the tab electrode, the bus barelectrode is likely to be separated from a surface of the photovoltaicelement.

SUMMARY OF THE INVENTION

The present invention has been proposed in order to solve theaforementioned problem, and an object of the present invention is toprovide a photovoltaic module capable of suppressing separation of a tabelectrode.

In order to attain the aforementioned object, a photovoltaic moduleaccording to an aspect of the present invention comprises a plurality ofphotovoltaic elements each including a plurality of semiconductor layersincluding a photoelectric conversion layer and a finger electrode forcollecting generated currents, formed on the semiconductor layers on aside of a light receiving surface and a tab electrode for electricallyconnecting the plurality of photovoltaic elements. The tab electrode iselectrically connected to the finger electrode and bonded on the lightreceiving surface through an insulating bonding material in a regioncorresponding to a power generation region of the photovoltaic element.

In the photovoltaic module according to this aspect, as hereinabovedescribed, the tab electrode is directly bonded on the light receivingsurface through the insulating bonding material in the regioncorresponding to the power generation region of the photovoltaicelement, whereby a bonding strength between the element and the tabelectrode can be increased as compared with a bonding strength betweenthe element and the tab electrode (bus bar electrode) in a case wherethe tab electrode is bonded on the light receiving surface through thebus bar electrode formed of conductive paste having no strong bondingforce. Thus, separation of the tab electrode from the element can besuppressed. Consequently, also in a case where the finger electrode(collector) forming of conductive paste is included, the separation ofthe tab electrode can be suppressed. The tab electrode is bonded on thelight receiving surface without the bus bar electrode, whereby the busbar electrode can be omitted. Thus, an electrode structure can besimplified. In the region corresponding to the power generation regionof the photovoltaic element, the tab electrode is bonded on the lightreceiving surface through the insulating bonding material, whereby adark current can be inhibited from flowing through the bonding materialdissimilarly to a case where the tab electrode is bonded on the lightreceiving surface through conductive bonding material. Thus, reductionin a characteristic of the photovoltaic module can be suppressed.

In the photovoltaic module according to the aforementioned aspect, theinsulating bonding material is preferably provided in a regioncorresponding to the power generation region of the photovoltaicelement, in which the finger electrode is not formed. According to thisstructure, the element and the tab electrode can be bonded through theinsulating bonding material in the region in which the finger electrodeis not formed, whereby the tab electrode and the finger electrode can beeasily electrically connected to each other by a solder or the like.

In the photovoltaic module according to the aforementioned aspect, aplurality of the finger electrodes are preferably so formed as to extendin a first direction and be spaced from each other at a prescribedinterval in a second direction intersecting with the first direction,the tab electrode is preferably so arranged as to extend in the seconddirection, and the insulating bonding material is preferably provided ina region in which the tab electrode is arranged and the finger electrodeis not formed. According to this structure, the element and the tabelectrode can be bonded through the insulating bonding material in theregion in which the tab electrode is arranged without preventingelectrical connection of the tab electrode and the finger electrode.

In the aforementioned structure in which a plurality of the fingerelectrodes are formed to be spaced from each other at a prescribedinterval in the second direction, the insulating bonding materials maybe provided in a plurality of regions located between the fingerelectrodes adjacent in the second direction, in which the tab electrodeis arranged. According to this structure, a bonding region of theelement and the tab electrode can be increased in the region in whichthe tab electrode is arranged without preventing electrical connectionof the tab electrode and the finger electrode.

In the aforementioned structure in which a plurality of the fingerelectrodes are formed to be spaced from each other at a prescribedinterval in the second direction, the plurality of finger electrodes maybe divided into a plurality of groups each including a prescribed numberof the finger electrodes, the prescribed number of the finger electrodesincluded in the same group may be so formed that a distance in thesecond direction between the finger electrodes adjacent in a region inwhich the tab electrode is arranged is smaller than a distance in thesecond direction between the finger electrodes adjacent in a region inwhich the tab electrode is not arranged, and the insulating bondingmaterials may be provided in a plurality of regions located between thegroups adjacent in the second direction, in which the tab electrode isarranged. According to this structure, the distance in the seconddirection between the adjacent finger electrodes is increased in theregion in which the tab electrode is arranged, whereby an area of aregion to which the insulating bonding material arranged between theadjacent finger electrodes is applied can be increased. Thus,application of the insulating bonding material to the light receivingsurface can be easily performed.

In the aforementioned structure in which a plurality of the fingerelectrodes are formed to be spaced from each other at a prescribedinterval in the second direction, the plurality of finger electrodes maybe divided into a plurality of groups each including a prescribed numberof the finger electrodes, the prescribed number of the finger electrodesincluded in the some group may be aggregated into one finger electrodeof the prescribed number of the finger electrodes in a region in whichthe tab electrode is arranged, and the insulating bonding materials maybe provided in a plurality of regions located in the groups adjacent inthe second direction, in which the tab electrode is arranged. Accordingto this structure, an area of a region in which the finger electrode isnot formed can be increased in the region in which tab electrode isarranged, whereby an area of a bonding region of the element and the tabelectrode can be increased. Thus, a bonding strength between the elementand the tab electrode can be increased.

In this case, an interval between the aggregated finger electrodes oftwo of the groups adjacent to each other is preferably larger than adistance between the finger electrodes opposed to each other of two ofthe groups adjacent to each other. According to this structure, an areaof a region in which the finger electrode is not formed can be increasedin the region in which tab electrode is arranged, whereby an area of abonding region of the element and the tab electrode can be increased.

In the aforementioned structure in which the prescribed number of thefinger electrodes included in the same group may be aggregated into onefinger electrode, a width in the second direction of the aggregatedfinger electrode is preferably substantially equal to a width in thesecond direction of each of the finger electrodes located in regions inwhich the tab electrode is not arranged. According to this structure, itis possible to suppress increase in an area occupied by the aggregatedfinger electrode in the region in which the tab electrode is arranged.Thus, an area of a region in which the finger electrode is not formedcan be increased in the region in which tab electrode is arranged,whereby an area of a bonding region of the element and the tab electrodecan be increased.

In the aforementioned structure in which the prescribed number of thefinger electrodes included in the same group may be aggregated into onefinger electrode, a width in the second direction of the aggregatedfinger electrode located in the region in which the tab electrode isarranged is preferably larger than a width in the second direction ofeach of the finger electrodes located in regions in which the tabelectrode is not arranged. According to this structure, a contact areaof the tab electrode and the finger electrode can be increased in theregion in which the tab electrode is arranged, whereby contactresistance between the tab electrode and the finger electrode can bereduced.

In this case, a width in the second direction of the aggregated fingerelectrode is preferably smaller than a distance in the second directionbetween two of the finger electrodes located at outermost positions inthe group in a region in which the tab electrode is not arranged.According to this structure, an area of a region in which the fingerelectrode is not formed can be increased in the region in which tabelectrode is arranged, whereby an area of a bonding region of theelement and the tab electrode can be increased.

In the photovoltaic module according to the aforementioned aspect, thetab electrode is preferably electrically connected to the fingerelectrode through a solder material. According to this structure, thetab electrode and the finger electrode can be easily electricallyconnected to each other by the solder material.

In this case, the solder materials are provided over substantiallyentire regions in which the finger electrode and the tab electrode areoverlapped in plan view. According to this structure, an area of anelectrical connection portion of the finger electrode and the tabelectrode can be increased. Thus, the finger electrode and the tabelectrode can be inhibited from being electrically disconnected to eachother, and resistance of a connection portion of the finger electrodeand the tab electrode can be reduced.

In the aforementioned structure in which the tab electrode iselectrically connected to the finger electrode through the soldermaterial, the solder material and the insulating bonding material arepreferably so provided as to be spaced at a prescribed interval.According to this structure, the insulating bonding material can beinhibited from protruding into the region in which the solder materialis provided. Thus, normal electrical connection of the finger electrodeand the tab electrode by the solder material can be inhibited from beinghindered due to the protruding bonding material.

In the aforementioned structure in which the tab electrode iselectrically connected to the finger electrode through the soldermaterial, the finger electrode is preferably so formed as to extend in afirst direction, the tab electrode is preferably so arranged as toextend in a second direction intersecting with the first direction, andthe finger electrode is preferably divided in a region in which the tabelectrode is arranged so as not to cross the region in which the tabelectrode is arranged. According to this structure, the finger electrodeis not formed in the region in which the tab electrode is arranged,whereby the insulating bonding material can be so provided as to extendcontinuously along the second direction. Thus, an area of a bondingregion of the element and the tab electrode can be further increased,whereby a bonding strength between the element and the tab electrode canbe further increased.

In the aforementioned structure in which the tab electrode is soarranged as to extend in the second direction, the insulating bondingmaterial is preferably so provided in the region in which the tabelectrode is arranged as to extend continuously along the seconddirection. According to this structure, an area of a bonding region ofthe element and the tab electrode can be easily further increased.

In the aforementioned structure in which the insulating bonding materialis so provided as to extend continuously along the second direction, thesolder material is preferably so provided in portions of side surfacesin the first direction of the tab electrode and the insulating bondingmaterial as to electrically connect the side surface of the tabelectrode and an divided end of the finger electrode. According to thisstructure, even if the finger electrode is divided in the region inwhich the tab electrode is arranged, the tab electrode and the fingerelectrode can be easily electrically connected to each other through thesolder material.

In this case, the solder materials are preferably so provided inportions of both side surfaces in the first direction of the tabelectrode and the insulating bonding material as to electrically connectboth side surfaces of the tab electrode and both divided ends of thefinger electrode. According to this structure, an area of an electricalconnection portion of the finger electrode and the tab electrode can beincreased. Thus, normal electrical connection of the finger electrodeand the tab electrode by the solder material can be inhibited from beinghindered, and resistance of a connection portion of the finger electrodeand the tab electrode can be reduced.

In the photovoltaic module according to the aforementioned aspect, thephotovoltaic element preferably includes a translucent conductive filmformed closer to the light receiving surface than the semiconductorlayer, and the tab electrode is preferably bonded to the translucentconductive film through the insulating bonding material. According tothis structure, the photovoltaic element and the tab electrode can beeasily bonded to each other.

The foregoing and other objects, features, aspects and advantages of thepresent invention will become more apparent from the following detaileddescription of the present invention when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing a structure of a photovoltaic moduleaccording to a first embodiment of the present invention;

FIG. 2 is a plan view showing a photovoltaic element constituting thephotovoltaic module according to the first embodiment shown in FIG. 1,to which tab electrodes are connected;

FIG. 3 is a sectional view taken along a line 100-100 in FIG. 2;

FIG. 4 is a sectional view taken along a line 200-200 in FIG. 2;

FIG. 5 is a sectional view taken along a line 300-300 in FIG. 2;

FIG. 6 is a plan view showing configuration of finger electrodes of thephotovoltaic element constituting the photovoltaic module according tothe first embodiment shown in FIG. 1;

FIG. 7 is a plan view showing the photovoltaic element constituting thephotovoltaic module according to the first embodiment shown in FIG. 1,from which the tab electrodes are removed;

FIG. 8 is a plan view showing configuration of finger electrodes of aphotovoltaic element constituting a photovoltaic module according to afirst modification of the first embodiment;

FIG. 9 is a plan view showing the photovoltaic element constituting thephotovoltaic module according to the first modification of the firstembodiment, from which the tab electrodes are removed;

FIG. 10 is a plan view showing configuration of finger electrodes of aphotovoltaic element constituting a photovoltaic module according to asecond modification of the first embodiment;

FIG. 11 is a plan view showing the photovoltaic element constituting thephotovoltaic module according to the second modification of the firstembodiment, from which the tab electrodes are removed;

FIG. 12 is a plan view showing configuration of finger electrodes of aphotovoltaic element constituting a photovoltaic module according to athird modification of the first embodiment;

FIG. 13 is a plan view showing the photovoltaic element constituting thephotovoltaic module according to the third modification of the firstembodiment, from which the tab electrodes are removed;

FIG. 14 is a plan view showing a photovoltaic element constituting aphotovoltaic module according to a second embodiment of the presentinvention, to which tab electrodes are connected;

FIG. 15 is a sectional view taken along a line 400-400 in FIG. 14;

FIG. 16 is a sectional view taken along a line 500-500 in FIG. 14;

FIG. 17 is a sectional view taken along a line 600-600 in FIG. 14;

FIG. 18 is a plan view showing configuration of finger electrodes of aphotovoltaic element constituting a photovoltaic module according to thesecond embodiment shown in 14; and

FIG. 19 is a plan view showing the photovoltaic element constituting thephotovoltaic module according to the second embodiment shown in FIG. 14,from which the tab electrodes are removed.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of the present invention will be hereinafter described withreference to the drawings.

First Embodiment

A structure of a photovoltaic module according to a first embodimentwill be now described with reference to FIGS. 1 to 7.

The photovoltaic module according to the first embodiment includes aplurality of photovoltaic elements 1 as shown in FIG. 1 and has astructure in which the plurality of photovoltaic elements 1 areelectrically connected through tab electrodes 2. The tab electrodes 2electrically connecting the plurality of photovoltaic elements 1 are soarranged as to be electrically connected to finger electrodes 18(19)serving as after-mentioned collectors and extend in a direction Yperpendicular to a direction X (direction in which the finger electrodes18(19) extend), as shown in FIGS. 1 and 2. The tab electrodes 2 consistof copper foil having a thickness of about 200 μm to about 400 μm and awidth of about 1 mm to about 2 mm. A filler 3 consisting of EVA(ethylene vinyl acetate) covers the plurality of photovoltaic elements 1as shown in FIG. 1. A surface protector 4 consisting of a glass isprovided on an upper surface of the filer 3, and a back surfaceprotector 5 consisting of PVF (poly vinyl fluoride) is provided on alower surface of the filler 3.

According to each photovoltaic element 1 of the first embodiment, asubstantially intrinsic i-type amorphous silicon layer 12 having athickness of about 5 nm to about 20 nm and a p-type amorphous siliconlayer 13 having a thickness of about 5 nm to about 20 nm aresuccessively formed on an upper surface of an n-type single-crystallinesilicon substrate 11 having a thickness of about 180 μm to about 300 μm,as shown in FIGS. 3 to 5. The n-type single-crystalline siliconsubstrate 11 is an example of the “photoelectric conversion layer” andthe “semiconductor layer” in the present invention, and the i-typeamorphous silicon layer 12 and the p-type amorphous silicon layer 13 areexamples of the “semiconductor layer” in the present invention. An ITO(indium tin oxide) film 14 as a translucent conductive film having athickness of about 30 nm to about 150 nm is formed on the p-typeamorphous silicon layer 13. According to the first embodiment, a surfaceof the ITO film 14 opposite to the n-type single-crystalline siliconsubstrate 11 is a light receiving surface 1 a on a front surface side.

An i-type amorphous silicon layer 15, an n-type amorphous silicon layer16 and an ITO film 17 are successively formed on a lower surface of then-type single-crystalline silicon substrate 11. Thicknesses of thei-type amorphous silicon layer 15, the n-type amorphous silicon layer 16and the ITO film 17 are about 5 nm to about 20 nm, about 5 nm to about20 nm and about 30 nm to about 150 nm, respectively. The i-typeamorphous silicon layer 15 and the n-type amorphous silicon layer 16 areexamples of the “semiconductor layer” in the present invention.According to the first embodiment, a surface of the ITO film 17 oppositeto the n-type single-crystalline silicon substrate 11 is a lightreceiving surface 1 b on a back surface side.

According to each photovoltaic element 1 of the first embodiment,regions formed with respective semiconductor layers (12, 13, 15 and 16)on the upper and lower surfaces of the n-type single-crystalline siliconsubstrate 11 in plane view are power generation regions. In other words,the light receiving surface 1 a constituted by the surface of the ITOfilm 14 formed on the p-type amorphous silicon layer 13 and the lightreceiving surface 1 b constituted by the surface of the ITO film 17formed on the n-type amorphous silicon layer 16 are arranged in regionscorresponding to the power generation region of the photovoltaic element1.

As shown in FIGS. 4 and 5, the finger electrodes 18 each having athickness of about 10 μm to about 50 μm and consisting of a conductivematerial formed by conductive paste consisting of epoxy resin or thelike prepared by incorporating fine powder of silver (Ag) are formed inprescribed regions on the light receiving surface 1 a of the frontsurface side (surface of the ITO film 14 opposite to the n-typesingle-crystalline silicon substrate 11). The finger electrodes 18 havea function of collecting generated currents. A plurality of the fingerelectrodes 18 are so formed as to extend in the direction X and bespaced from each other at intervals of about 2 mm in the direction Y(direction in which the tab electrodes 2 extend) perpendicular to thedirection X, as shown in FIG. 6. Each finger electrode 18 has a width ofabout 100 μm in the Y direction.

A plurality of the finger electrodes 19 having similar configuration tothe finger electrodes 18 on the front surface side and consisting of,for example, similar materials to the finger electrodes 18 on the frontsurface side are formed also in prescribed regions on the lightreceiving surface 1 b of the back surface side (surface of ITO film 17opposite to the n-type single-crystalline silicon substrate 11), asshown in FIGS. 4 and 5. The collectors of each photovoltaic element 1 ofthe first embodiment are constituted only by the aforementioned fingerelectrodes 18 and 19. In other words, bus bar electrodes for aggregatingcurrents collected by the finger electrodes 18 and 19 are not providedin the photovoltaic element 1 of the first embodiment.

In the photovoltaic module according to the first embodiment, each tabelectrode 2 is directly bonded to the light receiving surface 1 athrough an insulating bonding layer 6 consisting of acrylicthermosetting resin in a region corresponding to the power generationregion on the front surface side of the photovoltaic element 1, as shownin FIGS. 3 and 5. According to the first embodiment, each insulatingbonding layer 6 bonding the light receiving surface 1 a and the tabelectrode 2 is provided in the region corresponding to the powergeneration region of the photovoltaic element 1 in which the fingerelectrode 18 is not formed, as shown in FIG. 7. More specifically,according to the first embodiment, the insulating bonding layer 6 isprovided in each region located between the finger electrodes 18adjacent in the direction Y, in which the tab electrode 2 is arranged.

According to the first embodiment, in each region in which the tabelectrode 2 is arranged, a solder layer 7 consisting of Sn—Ag—Cu isprovided on an upper surface of each of a plurality of the fingerelectrodes 18, as shown in FIGS. 5 and 7. The solder layers 7 areprovided over substantially entire regions in which the finger electrode18 and the tab electrode 2 are overlapped in plan view. The tabelectrodes 2 and the finger electrodes 18 are electrically connected toeach other by the solder layers respectively. As shown in FIGS. 5 and 7,the solder layers 7 are so provided as to be spaced from the insulatingbonding layers 6 at prescribed intervals.

A method of connecting the tab electrodes 2 on the back surface side ofeach photovoltaic element 1 is similar to the aforementioned method ofconnecting the tab electrodes 2 on the front surface side of eachphotovoltaic element 1, as shown in FIGS. 3 to 5. More specifically,each tab electrode 2 is directly bonded to the light receiving surface 1b through insulating bonding layer 6 in a region corresponding to thepower generation region on the back surface side of the photovoltaicelement 1. The tab electrodes 2 are electrically connected to the fingerelectrodes 19 through the solder layers 7, respectively.

According to the first embodiment, as hereinabove described, the tabelectrodes 2 are directly bonded to the light receiving surface 1 athrough the insulating bonding layers 6 in the region corresponding tothe power generation region of the front surface side of thephotovoltaic element 1, whereby a bonding strength between the lightreceiving surface 1 a and the tab electrodes 2 can be increased ascompared with a bonding strength between the light receiving surface 1 aand the tab electrodes 2 in a conventional case where the tab electrodes2 are bonded through bus bar electrodes formed of conductive paste onthe light receiving surface 1 a without using the insulating bondinglayers 6. Thus, separation of the tab electrodes 2 from the lightreceiving surface in can be suppressed. Consequently, also in a casewhere the finger electrodes (collectors) 18 consisting of conductivepaste are included, the separation of the tab electrodes 2 can besuppressed.

According to the first embodiment, as hereinabove described, the tabelectrodes 2 are bonded to the light receiving surface 1 a without busbar electrodes, whereby the bus bar electrodes can be omitted. Thus, anelectrode structure can be simplified.

According to the first embodiment, as hereinabove described, in theregion corresponding to the power generation region on the front surfaceside of each photovoltaic element 1, the tab electrodes 2 are bonded tothe light receiving surface 1 a through the insulating bonding layers 6,whereby a dark current can be inhibited from flowing to the tabelectrodes 2 through the bonding layers 6 dissimilarly to a case wherethe tab electrodes 2 are bonded to the light receiving surface 1 athrough conductive bonding layers. Thus, reduction in a characteristicof the photovoltaic module can be suppressed.

According to the first embodiment, as hereinabove described, eachinsulating bonding layer 6 is provided in the region in which the tabelectrode 2 is arranged and the finger electrode 18 is not formed,whereby the light receiving surface 1 a and each tab electrode 2 can bebonded through the insulating bonding layer 6 in the region in which thetab electrode 2 is arranged without preventing electrical connection ofthe tab electrode 2 and the finger electrode 18. In this case, theinsulating bonding layer 6 is provided in each region located betweenthe finger electrodes 18 adjacent in the direction Y, in which the tabelectrode 2 is arranged, a bonding region between the light receivingsurface 1 a and each tab electrode 2 can be increased in the region inwhich the tab electrodes 2 is arranged.

According to the first embodiment, as hereinabove described, the tabelectrodes 2 and the finger electrodes are electrically connected toeach other through the solder layers 7 respectively, whereby the tabelectrodes 2 and the finger electrodes 18 can be easily connected toeach other by the solder layers 7 respectively.

According to the first embodiment, as hereinabove described, connectionof the tab electrodes 2 on the back surface side of each photovoltaicelement 1 is performed in a similar manner to the connection of the tabelectrodes 2 on the front surface side of each photovoltaic element 1,whereby separation of the tab electrodes 2 can be suppressed also in theback surface side of the photovoltaic element 1.

According to the first embodiment, as hereinabove described, the solderlayers 7 are provided over the substantially entire regions in which thefinger electrode 18 and the tab electrode 2 are overlapped in plan view,whereby an area of each electrical connection portion of the fingerelectrodes 18 and the tab electrodes 2 can be increased. Thus, thefinger electrodes 18 and the tab electrodes 2 can be inhibited frombeing electrically disconnected to each other, and resistance of theconnection portions of the finger electrodes 18 and the tab electrodes 2can be reduced.

According to the first embodiment, as hereinabove described, the solderlayers 7 are so provided as to be spaced from the insulating bondinglayers 6 at prescribed intervals, whereby the insulating bonding layers6 can be inhibited from protruding into the regions in which the solderlayer 7 is provided. Thus, normal electrical connection of the fingerelectrodes 18 and the tab electrodes 2 by the solder layers 7 can beinhibited from being hindered due to the protruding bonding layers 6.

A process of fabricating the photovoltaic module according to the firstembodiment will be now described with reference to FIGS. 1 to 7.

The i-type amorphous silicon layer 12 having a thickness of about 5 nmto about 20 nm and the p-type amorphous silicon layer 13 having athickness of about 5 nm to about 20 nm are successively formed on then-type single-crystalline silicon substrate 11 having a thickness ofabout 180 μm to about 300 μm by plasma CVD (chemical vapor deposition)as shown in FIGS. 3 to 5. Thereafter, the i-type amorphous silicon layer15 having a thickness of about 5 nm to about 20 nm and the n-typeamorphous silicon layer 16 having a thickness of about 5 nm to about 20nm are successively formed on the lower surface of the n-typesingle-crystalline silicon substrate 11 by plasma CVD. Then, after theITO film 14 having a thickness of about 30 nm to about 150 nm are formedon the p-type amorphous silicon layer 13 by sputtering, the ITO film 17having a thickness of about 30 nm to about 150 nm is formed also on anlower surface of the n-type amorphous silicon layer 16.

The conductive paste consisting of epoxy resin or the like prepared byincorporating fine powder of Ag is applied to prescribed regions on theITO film 14 by screen printing, as shown in FIGS. 4 and 5. Thereafter,the conductive paste is hardened, thereby forming the finger electrodes18 on the front surface side consisting of the conductive material eachhaving a thickness of about 10 μm to about 50 μm in the prescribedregions on the ITO film 14. At this time, a plurality of the fingerelectrodes 18 on the front surface side are so formed as to extend inthe direction X and be spaced from each other at intervals of about 2 mmin the direction Y perpendicular to the direction X, as shown in FIG. 6.Thereafter, a plurality of the finger electrodes 19 on the back surfaceside having similar configuration to the finger electrodes 18 on thefront surface side are formed also in the prescribed regions on thelower surface of the ITO film 17 by a forming process similar to theaforementioned forming process of the finger electrodes 18 on the frontsurface side. Thus, the photovoltaic elements 1 constituting thephotovoltaic module according to the first embodiment are formed.

As shown in FIG. 7, a bonding material consisting of insulating resinpaste for forming the bonding layer 6, consisting of acrylicthermosetting resin is applied to each region located between the fingerelectrodes 18 adjacent in the direction Y on the ITO film 14, in whichthe tab electrode 2 on the front surface side is arranged, by screenprinting. Solder paste consisting of Sn—Ag—Cu for forming the solderlayer 7 is applied to the upper surface of each of a plurality of thefinger electrodes 18 in the regions where the tab electrode 2 on thefront surface side is arranged, by screen printing.

Thereafter the tab electrodes 2 each consisting of copper foil having athickness of about 200 μm to about 400 μm and a width of about 1 mm toabout 2 mm are pressed against the regions to which the aforementionedresin paste and solder paste are applied. Heat treatment is performedunder a condition of a temperature of about 150° C. to about 200° C. forabout 10 minutes to about 60 minutes by hot air heating in this state,thereby hardening the resin paste. Therefore, the resin paste becomesthe bonding layers 6 and the surface (light receiving surface 1 a) ofthe ITO film 14 and the tab electrodes 2 are bonded through the bondinglayers 6. Thereafter, heat treatment is performed under a condition of atemperature of about 230° C. to about 260*C by hot air heating, therebyhardening the solder paste. Therefore, the solder paste becomes thesolder layers 7 and the tab electrodes 2 and the finger electrodes 18are electrically connected to each other through the solder layers 7respectively. Thus, the tab electrodes 2 are connected to the frontsurface of the photovoltaic element 1 as shown in FIG. 2.

The tab electrodes 2 are connected also to the back surface of eachphotovoltaic element 1 by a connecting process similar to theaforementioned connecting process of the tab electrodes 2 on the frontsurface side. In other words, the tab electrodes 2 are bonded to thelight receiving surface 1 b through the insulating bonding layers 6, andelectrically connected to the finger electrodes 19 through the solderlayers 7 respectively.

Finally, an EVA sheet for forming the filler 3, a plurality of thephotovoltaic elements 1 connected by the tab electrodes 2, an EVA sheetfor forming the filler 3, and the back surface protector 5 consisting ofPVF are successively deposited on the surface protector 4 consisting ofglass, as shown in FIG. 1. Thereafter, the photovoltaic module accordingto the first embodiment are formed by performing a vacuum laminatingprocess while heating.

With reference to FIGS. 8 and 9, a structure of a photovoltaic moduleaccording to a first modification of the first embodiment will be nowdescribed. In a photovoltaic element 21 according to the firstmodification of the first embodiment, collectors constituted only by thefinger electrodes 28 a are formed in prescribed regions on the lightreceiving surface 1 a of the front surface side similarly to theaforementioned first embodiment. A plurality of the finger electrodes 28a serving as the collectors are so formed as to extend in the directionX and be spaced at prescribed intervals in the direction Y (direction inwhich the tab electrodes 2 extend) perpendicular to the direction X.Each finger electrode 28 a has a thickness of about 10 μm to about 50 μmand a width of about 100 μm in the direction Y, and consists of aconductive material formed by conductive paste consisting of epoxy resinor the like prepared by incorporating fine powder of Ag.

According to the first modification of the first embodiment, a pluralityof the finger electrodes 28 a are divided into a plurality of groups 28each including three finger electrodes 28 a as shown in FIG. 8. Thethree finger electrodes 28 a in the same group 28 are so formed that adistance L1 in the direction Y between the finger electrodes 28 aadjacent in the regions in which the tab electrode 2 is arranged issmaller than a distance L2 in the direction Y between the fingerelectrodes 28 a adjacent in the regions in which the tab electrode 2 isnot arranged.

According to the first modification of the first embodiment, a pluralityof the finger electrodes having similar configuration to the fingerelectrodes 28 a on the front surface side and consisting of similarmaterials to the finger electrodes 28 a on the front surface side areformed also in prescribed regions on a light receiving surface of theback surface side (not shown).

In the photovoltaic module according to the first modification of thefirst embodiment, each tab electrode 2 is directly bonded to the lightreceiving surface 1 a through insulating bonding layer 26 consisting ofacrylic thermosetting resin in a region corresponding to the powergeneration region on the front surface side of the photovoltaic element21, as shown in FIG. 9. According to the first modification of the firstembodiment, each insulating bonding layer 26 bonding the light receivingsurface 1 a and the tab electrode 2 is provided in the regioncorresponding to the power generation region of the photovoltaic element21 in which the finger electrode 28 a is not formed. More specifically,according to the first modification of the first embodiment, theinsulating bonding layer 26 is provided in each region located betweenthe adjacent groups 28 each including the three finger electrodes 28 ain the direction Y, in which the tab electrode 2 is arranged.

According to the first modification of the first embodiment, in eachregion in which the tab electrode 2 is arranged, a solder layer 27consisting of Sn—Ag—Cu is provided on an upper surface of each of aplurality of the finger electrodes 28 a. The tab electrodes 2 and thefinger electrodes 28 a are electrically connected to each other by thesolder layers 27 respectively.

A method of connecting the tab electrodes 2 on the back surface side ofthe photovoltaic element 21 is similar to the aforementioned method ofconnecting the tab electrodes 2 on the front surface side of thephotovoltaic element 21.

According to the first modification of the first embodiment, ashereinabove described, the three finger electrodes 28 a in the samegroup 28 are so formed that a distance L1 in the direction Y between theadjacent finger electrodes 28 a in the regions in which the tabelectrode 2 is arranged is smaller than a distance L2 in the direction Ybetween the adjacent finger electrodes 28 a in the regions in which thetab electrode 2 is not arranged, and the insulating bonding layer 26 isprovided in each region located between the adjacent groups 28 in thedirection Y in which the tab electrode 2 is arranged. Therefore, thedistance in the direction Y between the adjacent groups 28 is increasedin each region in which the tab electrode 2 is arranged, whereby an areaof a region to which the bonding layer 26 arranged between the groups 28is applied can be increased. Thus, application of the insulating bondinglayers 26 to the light receiving surface 1 a can be easily performed.

Remaining effects of the first modification of the first embodiment aresimilar to those of the aforementioned first embodiment.

A structure of a photovoltaic module according to a second modificationof the first embodiment will be now described with reference to FIGS. 10and 11. In a photovoltaic element 31 according to the secondmodification of the first embodiment, collectors constituted only by thefinger electrodes 38 a are formed in prescribed regions on the lightreceiving surface 1 a of the front surface side similarly to theaforementioned first embodiment. A plurality of the finger electrodes 38a serving as the collectors are so formed as to extend in the directionX and be spaced at prescribed intervals in the direction Y (direction inwhich the tab electrodes 2 extend) perpendicular to the direction X.Each finger electrode 38 a has a thickness of about 10 μm to about 50 μmand a width of about 100 μm in the direction Y, and consists of aconductive material formed by conductive paste consisting of epoxy resinor the like prepared by incorporating fine powder of Ag.

According to the second modification of the first embodiment, aplurality of the finger electrodes 38 a are divided into a plurality ofgroups 38 each including three finger electrodes 38 a as shown in FIG.10. The three finger electrodes 38 a included in the same group 38 areaggregated into one finger electrode 38 a of the three finger electrodes38 a in each region in which the tab electrode 2 is arranged. Accordingto the second modification of the first embodiment, a width W1 in thedirection Y of each aggregated finger electrode 38 a located in theregion in which the tab electrode 2 is arranged is substantiallyidentical with a width W2 (about 100 μm) in the direction Y of eachfinger electrode 38 a located in the region in which the tab electrode 2is not arranged.

An interval D1 between the aggregated finger electrodes 38 a of the twogroups 38 adjacent to each other is larger than a distance D2 betweenthe finger electrodes 38 a opposed to each other of the two groups 38adjacent to each other.

According to the second modification of the first embodiment, aplurality of the finger electrodes having similar configuration to thefinger electrodes 38 a on the front surface side and consisting of, forexample, similar materials to the finger electrodes 38 a on the frontsurface side are formed also in prescribed regions on the lightreceiving surface on the back surface side (not shown).

In the photovoltaic module according to the second modification of thefirst embodiment, each tab electrode 2 is directly bonded to the lightreceiving surface 1 a through an insulating bonding layer 36 consistingof acrylic thermosetting resin in a region corresponding to the powergeneration region on the front surface side of the photovoltaic element31, as shown in FIG. 11. According to the second modification of thefirst embodiment, each insulating bonding layer 36 bonding the lightreceiving surface 1 a and the tab electrode 2 is provided in the regioncorresponding to the power generation region of the photovoltaic element31 in which the finger electrode 38 a is not formed. More specifically,according to the second modification of the first embodiment, theinsulating bonding layer 36 is provided in each region located betweenthe adjacent groups 38 each including the three finger electrodes 38 ain the direction Y, in which the tab electrode 2 is arranged.

According to the second modification of the first embodiment, in theregions in which the tab electrode 2 is arranged, solder layers 37consisting of Sn—Ag—Cu are provided on upper surfaces of a plurality ofthe finger electrodes 38 a. The tab electrodes 2 and the fingerelectrodes 38 a are electrically connected to each other by the solderlayers 37 respectively.

A method of connecting the tab electrodes 2 on the back surface side ofthe photovoltaic element 31 is similar to the aforementioned method ofconnecting the tab electrodes 2 on the front surface side of thephotovoltaic element 31.

According to the second modification of the first embodiment, ashereinabove described, the three finger electrodes 38 a included in thesame group 38 are aggregated into one finger electrode 38 a of the threefinger electrodes 38 a in each region in which the tab electrode 2 isarranged, and the insulating bonding layer 36 is provided in each regionlocated between the adjacent groups 38 in the direction Y in which thetab electrode 2 is arranged. Therefore, an area of each region in whichthe finger electrode 38 a is not formed can be increased in the regionin which tab electrode 2 is arranged, whereby an area of a bondingregion of the light receiving surface 1 a and each tab electrode 2 canbe increased. Thus, a bonding strength between the light receivingsurface 1 a and the tab electrodes 2 can be increased.

Remaining effects of the second modification of the first embodiment aresimilar to those of the aforementioned first embodiment.

A structure of a photovoltaic module according to a third modificationof the first embodiment will be now described with reference to FIGS. 12and 13. In a photovoltaic element 41 according to the third modificationof the first embodiment, collectors constituted only by the fingerelectrodes 48 a are formed in prescribed regions on the light receivingsurface 1 a of the front surface side similarly to the aforementionedfirst embodiment. A plurality of the finger electrodes 48 a serving asthe collectors are so formed as to extend in the direction X and bespaced at prescribed intervals in the direction Y (direction in whichthe tab electrodes 2 extend) perpendicular to the direction X. Eachfinger electrode 48 a has a thickness of about 10 μm to about 50 μm anda width of about 100 μm in the direction Y, and consists of a conductivematerial formed by conductive paste consisting of epoxy resin or thelike prepared by incorporating fine powder of Ag.

According to the third modification of the first embodiment, a pluralityof the finger electrodes 48 a are divided into a plurality of groups 48each including three finger electrodes 48 a as shown in FIG. 12. Thethree finger electrodes 48 a included in the same group 48 areaggregated into one finger electrode 48 a of the three finger electrodes48 a in each region in which the tab electrode 2 is arranged. Accordingto the third modification of the first embodiment, a width W11 (about300 μm to about 1 mm) in the direction Y of each aggregated fingerelectrode 48 a located in the region in which the tab electrode 2 isarranged is larger than a width W12 (about 100 μm) in the direction Y ofeach finger electrode 48 a located in the region in which the tabelectrode 2 is not arranged and is smaller than a distance L11 betweenthe finger electrodes 48 a located at outermost positions of the threefinger electrodes 48 a included in the same group 48.

An interval D11 between the aggregated finger electrodes 48 a in the twogroups 48 adjacent to each other is larger than a distance D12 betweenthe finger electrodes 48 a opposed to each other of the two groups 48adjacent to each other.

According to the third modification of the first embodiment, a pluralityof the finger electrodes having similar configuration to the fingerelectrodes 48 a on the front surface side and consisting of similarmaterials to the finger electrodes 48 a on the front surface side areformed also in prescribed regions on the light receiving surface of theback surface side (not shown).

In the photovoltaic module according to the third modification of thefirst embodiment, each tab electrode 2 is directly bonded to the lightreceiving surface 1 a through an insulating bonding layer 46 consistingof acrylic thermosetting resin in a region corresponding to the powergeneration region on the front surface side of the photovoltaic element41, as shown in FIG. 13. According to the third modification of thefirst embodiment, each insulating bonding layer 46 bonding the lightreceiving surface 1 a and the tab electrode 2 is provided in the regioncorresponding to the power generation region of the photovoltaic element41 in which the finger electrode 48 a is not formed. More specifically,according to the third modification of the first embodiment, theinsulating bonding layer 46 is provided in each region located betweenthe adjacent groups 48 each including the three finger electrodes 48 ain the direction Y, in which the tab electrode 2 is arranged.

According to the third modification of the first embodiment, in theregions in which the tab electrode 2 is arranged, solder layers 47consisting of Sn—Ag—Cu are provided on upper surfaces of the fingerelectrodes 48 a each having the larger width W11 (see FIG. 12) in thedirection Y. The tab electrodes 2 and the finger electrodes 48 a areelectrically connected to each other by the solder layers 47respectively.

A method of connecting the tab electrodes 2 on the back surface side ofthe photovoltaic element 41 is similar to the aforementioned method ofconnecting the tab electrodes 2 on the front surface side of thephotovoltaic element 41.

According to the third modification of the first embodiment, ashereinabove described, the three finger electrodes 48 a included in thesame group 48 are aggregated into one finger electrode 48 a of the threefinger electrodes 48 a in each region in which the tab electrode 2 isarranged, and the insulating bonding layer 46 is provided in each regionlocated between the adjacent groups 48 in the direction Y in which thetab electrode 2 is arranged. Thus, an area of a bonding region of thelight receiving surface 1 a and each tab electrode 2 can be increasedsimilarly to the second modification of the aforementioned firstembodiment, whereby a bonding strength between the light receivingsurface 1 a and the tab electrodes 2 can be increased.

According to the third modification of the first embodiment, ashereinabove described, the width W11 in the direction Y of eachaggregated finger electrode 48 a located in the region in which the tabelectrode 2 is arranged is larger than the width W12 in the direction Yof each finger electrode 48 a located in the region in which the tabelectrode 2 is not arranged. Thus, a contact area of each tab electrode2 and the finger electrode 48 a can be increased in the region in whichthe tab electrode 2 is arranged, whereby contact resistance between thetab electrodes 2 and the finger electrode 48 a can be reduced.

Remaining effects of the third modification of the first embodiment aresimilar to those of the aforementioned first embodiment.

Second Embodiment

According to a second embodiment of the present invention, a case wherefinger electrodes are divided in regions where a tab electrode isarranged will be now described with reference to FIGS. 14 to 19,dissimilarly to the aforementioned first embodiment.

In a photovoltaic module according to the second embodiment, tabelectrodes 52 electrically connecting a plurality of photovoltaicelements 51 are so arranged as to be electrically connected to fingerelectrodes 58(59) serving as after-mentioned collectors and extend in adirection Y perpendicular to a direction X (direction in which thefinger electrodes 58(59) extend), as shown in FIG. 14. Each tabelectrode 52 consists of copper foil having a thickness of about 200 μmto about 400 μm and a width of about 1 mm to about 2 mm.

In the photovoltaic elements 51 according to the second embodiment, asshown in FIGS. 15 to 17, the i-type amorphous silicon layer 12, thep-type amorphous silicon layer 13 and the ITO film 14 are successivelyformed on the n-type single-crystalline silicon substrate 11 similarlyto the photovoltaic elements 1 according to the aforementioned firstembodiment. The i-type amorphous silicon layer 15, the n-type amorphoussilicon layer 16 and the ITO film 17 are successively formed on thelower surface of the n-type single-crystalline silicon substrate 11.

According to the second embodiment, a surface of the ITO film 14opposite to the n-type single-crystalline silicon substrate 11 is alight receiving surface 1 a on a front surface side and a surface of theITO film 17 opposite to the n-type single-crystalline silicon substrate11 is a light receiving surface 1 b on a back surface side, similarly tothe aforementioned first embodiment. The light receiving surfaces 1 aand 1 b are arranged in regions corresponding to the power generationregions.

As shown in FIG. 16, the finger electrodes 58 each having a thickness ofabout 10 μm to about 50 μm and consisting of a conductive materialformed by conductive paste consisting of epoxy resin or the likeprepared by incorporating fine powder of Ag are formed in prescribedregions on the light receiving surface 1 a of the front surface side. Aplurality of the finger electrodes 58 are so formed as to extend in thedirection X and be spaced from each other at intervals of about 2 mm inthe direction Y (direction in which the tab electrodes 52 extend)perpendicular to the direction X, as shown in FIG. 18. Each fingerelectrode 58 has a width of about 100 μm in the Y direction.

In the photovoltaic elements 51 according to the second embodiment, thefinger electrodes 58 are divided in the region in which the tabelectrode 52 is arranged so as not to cross the regions in which the tabelectrode 52 is arranged. In other words, according to the secondembodiment, each finger electrode 58 extending in the direction X isdivided into three.

A plurality of the finger electrodes 59 having similar configuration tothe finger electrodes 58 on the front surface side and consisting ofsimilar materials to the finger electrodes 58 on the front surface sideare formed also in prescribed regions on the light receiving surface 1 bof the back surface side, as shown in FIG. 16. The collectors of eachphotovoltaic element 51 of the second embodiment are constituted only bythe aforementioned finger electrodes 58 and 59. In other words, bus barelectrodes for aggregating currents collected by the finger electrodes58 and 59 are not provided in the photovoltaic element 51 of the secondembodiment.

In the photovoltaic module according to the second embodiment, each tabelectrode 52 is directly bonded to the light receiving surface 1 athrough insulating bonding layer 56 consisting of acrylic thermosettingresin in a region corresponding to the power generation region on thefront surface side of the photovoltaic element 51, as shown in FIGS. 15to 17. According to the second embodiment, each insulating bonding layer56 bonding the light receiving surface 1 a and the tab electrode 52 isprovided in the region corresponding to the power generation region ofthe photovoltaic element 51 in which the finger electrode 58 is notformed, as shown in FIG. 19. More specifically, according to the secondembodiment, the insulating bonding layer 56 is so provided in eachregion in which the tab electrode 52 is arranged so as extendcontinuously along the direction Y (direction in which the tabelectrodes 52 extend).

According to the second embodiment, solder layers 57 consisting ofSn—Ag—Cu are provided on both sides in the direction X of the region inwhich the tab electrode 52 on the light receiving surface 1 a isprovided as shown in FIGS. 16 and 19. Each solder layer 57 electricallyconnect a part of both side surfaces 52 a of the tab electrode 52 anddivided both ends 58 a of the finger electrode 58 in portions of theboth side surfaces in the direction X of the tab electrode 52 and theinsulating bonding layer 56, as shown in FIG. 16.

A method of connecting the tab electrodes 52 on the back surface side ofthe photovoltaic element 51 is similar to the aforementioned method ofconnecting the tab electrodes 52 on the front surface side of thephotovoltaic element 51, as shown in FIGS. 15 to 17. More specifically,each tab electrode 52 is directly bonded to the light receiving surface1 b through the insulating bonding layer 56 in a region corresponding tothe power generation region on the back surface side of the photovoltaicelement 51. The tab electrodes 52 are electrically connected to thefinger electrodes 59 through the solder layers 57, respectively.

Remaining structures of the second embodiment are similar to those ofthe aforementioned first embodiment.

According to the second embodiment, as hereinabove described, the tabelectrodes 52 are directly bonded to the light receiving surface 1 athrough the insulating bonding layers 56 in the region corresponding tothe power generation region of the front surface side of thephotovoltaic element 51, whereby a bonding strength between the lightreceiving surface 1 a and the tab electrodes 52 can be increased ascompared with a bonding strength between the light receiving surface 1 aand the tab electrodes 52 in a conventional case where the tabelectrodes 52 are bonded through bus bar electrodes formed of conductivepaste on the light receiving surface 1 a. Thus, separation of the tabelectrodes 52 from the light receiving surface 1 a can be suppressed.Consequently, also in a case where the finger electrodes (collectors) 58consisting of conductive paste are included, separation of the tabelectrodes 52 can be suppressed.

According to the second embodiment, as hereinabove described, eachfinger electrode 58 is divided in the region in which the tab electrode52 is arranged, whereby the finger electrode 58 is not formed in theregion in which the tab electrode 52 is arranged. Therefore, theinsulating bonding layers 56 can be so provided as to extendcontinuously along the direction Y. Thus, an area of a bonding region ofthe light receiving surface 1 a and each tab electrode 52 can beincreased, whereby a bonding strength between the light receivingsurface 1 a and each tab electrode 52 can be increased. In this case,the side surfaces of the tab electrodes 52 and the divided ends of thefinger electrodes 58 are electrically connected to each other in theportions of the both side surfaces in the direction X of the tabelectrodes 52 and the insulating bonding layers 56 through the solderlayers 57. Thus, even if the finger electrodes 58 are divided in theregions in which the tab electrode 52 is arranged, the tab electrodes 52and the finger electrodes 58 can be easily electrically connected toeach other through the solder layers 57, respectively.

According to the second embodiment, as hereinabove described, the tabelectrodes 52 on the back surface side of the photovoltaic element 51are connected in a similar manner to the tab electrodes 52 on the frontsurface side of the photovoltaic element 51, whereby separation of thetab electrodes 52 and reduction in the power generation region can besuppressed also on the back surface side of the photovoltaic element 51.

Remaining effects of the second embodiment are similar to those of theaforementioned first embodiment.

A process of fabricating the photovoltaic module according to the secondembodiment will be now described with reference to FIGS. 14 to 19.

The ITO films 14 and 17 are formed by a similar fabrication process tothe aforementioned first embodiment as shown in FIGS. 15 to 17.

Then, the conductive paste consisting of epoxy resin or the likeprepared by incorporating fine powder of Ag is applied to prescribedregions on the ITO film 14 by screen printing, as shown in FIG. 16.Thereafter, the conductive paste is hardened, thereby forming the fingerelectrodes 58 on the front surface side consisting of the conductivematerial each having a thickness of about 10 μm to about 50 μm in theprescribed regions on the ITO film 14. At this time, the fingerelectrodes 58 on the front surface side are so formed as to extend inthe direction X without crossing the regions in which the tab electrode52 is arranged, as shown in FIG. 18. In addition, a plurality of thefinger electrodes 58 on the front surface side are so formed as to bespaced from each other at intervals of about 2 mm in the direction Yperpendicular to the direction X. Thereafter, a plurality of the fingerelectrodes 59 on the back surface side having similar configuration tothe finger electrodes 58 on the front surface side are formed also inthe prescribed regions on the lower surface of the ITO film 17 by aforming process similar to the aforementioned forming process of thefinger electrodes 58 on the front surface side. Thus, the photovoltaicelements 51 constituting the photovoltaic module according to the secondembodiment are formed.

As shown in FIG. 19, insulating resin paste for forming the bondinglayer 56, consisting of acrylic thermosetting resin is applied to theITO film 14 in each region in which the tab electrode 52 on the frontsurface side is arranged so as to extend continuously along thedirection Y, by screen printing. Solder paste consisting of Sn—Ag—Cu forforming the solder layer 57 is applied to the both sides in the Xdirection of each region in which the tab electrode 52 on the ITO film14 of the front side is arranged so as to come in contact with ends ofeach finger electrode 58 on sides of the regions in which the tabelectrode 52 is arranged, by screen printing.

Thereafter, the tab electrodes 52 each consisting of copper foil havinga thickness of about 200 μm to about 400 μm and a width of about 1 mm toabout 2 mm are pressed against the regions to which the aforementionedresin paste is applied. Heat treatment is performed under a condition ofa temperature of about 150° C. to about 200° C. for about 10 minutes toabout 60 minutes by hot air heating in this state, thereby hardening theresin paste. Therefore, the resin paste becomes the bonding layers 56and the surface (light receiving surface 1 a) of the ITO film 14 and thetab electrodes 52 are bonded through the bonding layers 56 respectively.Thereafter, heat treatment is performed under a condition of atemperature of about 230° C. to about 260° C. by hot air heating,thereby hardening the solder paste. Therefore, the solder paste becomesthe solder layers 57 and the tab electrodes 52 and the finger electrodes58 are electrically connected to each other through the solder layers 57respectively. Thus, the tab electrodes 52 are connected to the frontsurface of the photovoltaic element 51 as shown in FIG. 14.

The tab electrodes 52 are connected also to the back surface of thephotovoltaic element 51 by a connecting process similar to theaforementioned connecting process of the tab electrodes 52 on the frontsurface side. In other words, the tab electrodes 52 are bonded to thelight receiving surface 1 b through the insulating bonding layers 56,and electrically connected to the finger electrodes 59 through thesolder layers 57 respectively.

Subsequent processes of fabricating the photovoltaic module according tothe second embodiment is similar to the processes after the tabelectrodes 2 of the aforementioned first embodiment are connected.

Although the present invention has been described and illustrated indetail, it is clearly understood that the same is by way of illustrationand example only and is not to be taken by way of limitation, the spiritand scope of the present invention being limited only by the terms ofthe appended claims.

For example, while the insulating resin paste consisting of acrylicthermosetting resin is employed as the bonding material for bonding thetab electrodes in the aforementioned first and second embodiments, thepresent invention is not restricted to this but insulating resin pasteconsisting of thermosetting resin other than acrylic thermosetting resinmay be alternatively employed. The thermosetting resin other thanacrylic thermosetting resin includes silicon thermosetting resin orepoxy thermosetting resin, for example. Alternatively, insulating resinpaste consisting UV curable resin or UV-thermosetting resin may be alsoemployed. When the insulating resin paste consisting UV curable resin orUV-thermosetting resin is hardened, the process is preferably performedin the following UV irradiation condition. In other words, thepreferable UV irradiation condition is a UV irradiation intensity ofabout 100 mW/cm² to about 600 mW/cm², UV irradiation time of about 1minute to about 5 minutes. When the insulating resin paste consisting ofUV-thermosetting resin is hardened, heat treatment may be performedunder a condition of a temperature of about 100° C. to about 180° C. forabout 10 minutes to about 90 minutes without UV irradiation.

While the resin paste and the solder paste are applied to the surface ofthe ITO film by screen printing in the aforementioned first and secondembodiments, the present invention is not restricted to this but theresin paste and the solder paste may be alternatively formed on thesurface of the ITO film by a formation method other than the screenprinting as far as formation in a minute (fine) region can be performed.For example, the resin paste and the solder paste may be alternativelyapplied to the surface of the ITO film by dispenser.

While the resin paste and the solder paste are hardened by hot airheating in the aforementioned first and second embodiments, the presentinvention is not restricted to this but the resin paste and the solderpaste may be alternatively hardened by a method other than hot airheating. A method other than hot air heating includes reflow heating,beam irradiation heating and laser irradiation heating, for example.

While the tab electrodes consisting of copper foil are employed in theaforementioned first and second embodiments, the present invention isnot restricted to this but tab electrodes of foil consisting of materialother than copper may be alternatively employed, or tab electrodes ofwire may be alternatively employed. Alternatively, the tab electrodes offoil or wire coated with solders in advance may be employed.

While the surface of the ITO film is the light receiving surface byforming the ITO film on the semiconductor layer in the aforementionedfirst and second embodiments, the present invention is not restricted tothis but the present invention may be applied to elements not formedwith the ITO film on the semiconductor layer. Alternatively, othertransparent conductive film may be employed instead of the ITO film.

While the photovoltaic elements each having a structure in which thei-type amorphous silicon layers are formed between the n-typesingle-crystalline silicon substrate and the p-type amorphous siliconlayer and between the n-type single-crystalline silicon substrate andthe n-type amorphous silicon layer are employed as photovoltaic elementsconstituting a photovoltaic module in the aforementioned first andsecond embodiments, the present invention Is not restricted to this butthe present invention can be applied to a photovoltaic module employingvarious types of photovoltaic elements such as single-crystallinephotovoltaic elements, amorphous photovoltaic elements andmicrocrystalline photovoltaic elements.

While the tab electrodes are bonded on the surface of the ITO film onthe semiconductor layer through the insulating bonding layers in theaforementioned first and second embodiments, the present invention isnot restricted to this but the tab electrodes may alternatively bebonded on the surface of the semiconductor layer through the insulatingbonding layers without forming the ITO film on the semiconductor layer.Alternatively, the ITO film may be so formed on the semiconductor layeras to expose a part of the surface of the semiconductor layer, and thetab electrodes may be alternatively bonded on the exposed surface of thesemiconductor layer through the insulating bonding layers. According tothis structure, a bonding strength of the element and each tab electrodecan be enhanced as compared with a case where the tab electrodes arebonded on the surface of the ITO film through the insulating bondinglayers.

While the resin paste and the solder paste are hardened by differentheat treatment processes respectively in the aforementioned first andsecond embodiments, the present invention is not restricted to this butthe resin paste and the solder paste may be alternatively hardened bythe same heat treatment processes.

While the tab electrodes and the finger electrodes are electricallyconnected to each other through the solder layers respectively in theaforementioned first embodiment, the present invention is not restrictedto this but the tab electrodes may be brought into contact with thefinger electrodes without the solder layers, thereby electricallyconnecting the tab electrodes and the finger electrodes.

1-29. (canceled)
 30. A photovoltaic module comprising: a plurality ofphotovoltaic elements including a first photovoltaic element and asecond photovoltaic element, the first photovoltaic element and thesecond photovoltaic element including a plurality of semiconductorlayers including a photoelectric conversion layer and a plurality offinger electrodes for collecting generated currents, formed above saidsemiconductor layers adjacent to a light receiving surface; and a tabelectrode extending in a first direction for electrically connectingbetween the first photovoltaic element and the second photovoltaicelement, wherein said tab electrode is electrically connected to saidfinger electrodes and bonded on said light receiving surface through aninsulating bonding material without bus bar electrodes in a region ofsaid first photovoltaic element where the finger electrodes are notformed, said tab electrode is in direct contact with said insulatingbonding material, said tab electrode is arranged in a region of asurface of the semiconductor layer on the side of the light receivingsurface in which the finger electrodes are formed and a region of thesurface of the semiconductor layer on the side of the light receivingsurface in which the finger electrodes are not formed, said insulatingbonding material bonds the region in which the finger electrodes are notformed with the tab electrode, and said finger electrodes are formedabove said semiconductor layers extending in a second directiontraversing the tab electrode in plan view, each of the plurality offinger electrodes extending in said second direction overlaps the tabelectrode extending in said first direction in plan view; and aconductive adhesive is formed on a first region where said plurality offinger electrodes overlap the tab electrode, wherein a portion of saidfinger electrode arranged at the first region is directly bonded on thelight receiving surface opposing respective tab electrode, and a secondregion other than said first region of the light receiving surfaceopposing respective tab electrode is directly bonded on the tabelectrode through said insulating bonding material in plan view.
 31. Thephotovoltaic module according to claim 30, wherein said insulatingbonding material is provided in a region corresponding to a powergeneration region of said photovoltaic elements, in which said fingerelectrodes are not formed.
 32. The photovoltaic module according toclaim 30, wherein said finger electrodes are so formed as to extend in afirst direction and be spaced from each other at a prescribed intervalin a second direction intersecting with said first direction, said tabelectrode is so arranged as to extend in said second direction, and saidinsulating bonding material is provided in a region in which said tabelectrode is arranged and said finger electrodes are not formed.
 33. Thephotovoltaic module according to claim 32, wherein said insulatingbonding materials are provided in a plurality of regions located betweensaid finger electrodes adjacent in said second direction, in which saidtab electrode is arranged.
 34. The photovoltaic module according toclaim 32, wherein said plurality of finger electrodes are divided into aplurality of groups each including a prescribed number of said fingerelectrodes, said prescribed number of said finger electrodes included inthe same said group are so formed that a distance in said seconddirection between said finger electrodes adjacent in a region in whichsaid tab electrode is arranged is smaller than a distance in said seconddirection between said finger electrodes adjacent in a region in whichsaid tab electrode is not arranged, and said insulating bondingmaterials are provided in a plurality of regions located between saidgroups adjacent in said second direction, in which said tab electrode isarranged.
 35. The photovoltaic module according to claim 32, whereinsaid plurality of finger electrodes are divided into a plurality ofgroups each including a prescribed number of said finger electrodes,said prescribed number of said finger electrodes included in the samesaid group are aggregated into one finger electrode of said prescribednumber of said finger electrodes in a region in which said tab electrodeis arranged, and said insulating bonding materials are provided in aplurality of regions located in said groups adjacent in said seconddirection, in which said tab electrode is arranged.
 36. The photovoltaicmodule according to claim 35, wherein a distance between said aggregatedfinger electrodes of two of said groups adjacent to each other is largerthan a distance between opposed said finger electrodes of two of saidgroups adjacent to each other.
 37. The photovoltaic module according toclaim 35, wherein a width in said second direction of said aggregatedfinger electrode is substantially equal to a width in said seconddirection of each of said finger electrodes located in regions in whichsaid tab electrode is not arranged.
 38. The photovoltaic moduleaccording to claim 35, wherein a width in said second direction of saidaggregated finger electrode located in said region in which said tabelectrode is arranged is larger than a width in said second direction ofeach of said finger electrodes located in regions in which said tabelectrode is not arranged.
 39. The photovoltaic module according toclaim 38, wherein a width in said second direction of said aggregatedfinger electrode is smaller than a distance in said second directionbetween two of said finger electrodes located at outermost positions insaid group in a region in which said tab electrode is not arranged. 40.The photovoltaic module according to claim 30, wherein said tabelectrode is electrically connected to said finger electrodes through asolder material.
 41. The photovoltaic module according to claim 40,wherein said solder materials are provided over substantially entireregions in which said finger electrodes and said tab electrode areoverlapped in plan view.
 42. The photovoltaic module according to claim40, wherein said solder material and said insulating bonding materialare so provided as to be spaced at a prescribed interval.
 43. Thephotovoltaic module according to claim 40, wherein said fingerelectrodes are so formed as to extend in a first direction, said tabelectrode is so arranged as to extend in a second direction intersectingwith said first direction, and said finger electrodes are divided in aregion in which said tab electrode is arranged so as not to cross saidregion in which said tab electrode is arranged.
 44. The photovoltaicmodule according to claim 43, wherein said insulating bonding materialis so provided in said region in which said tab electrode is arranged asto extend continuously along said second direction.
 45. The photovoltaicmodule according to claim 44, wherein said solder material is providedon portions of side surfaces of said tab electrode and portions of sidesurfaces of said insulating bonding material, wherein said side surfacesare perpendicular to surfaces where the tab electrode and insulatingbonding material are bonded to each other, so as to electrically connectsaid side of said tab electrode and a divided end of one of theplurality of finger electrodes.
 46. The photovoltaic module according toclaim 44, wherein said solder material is provided on portions of bothside surfaces of said tab electrode and portions of side surfaces ofsaid insulating bonding material, wherein said side surfaces areperpendicular to surfaces where the tab electrode and insulating bondingmaterial are bonded to each other, so as to electrically connect bothside surfaces of said tab electrode and both divided ends of one of theplurality of finger electrodes.
 47. The photovoltaic module according toclaim 30, wherein said photovoltaic element includes a translucentconductive film formed closer to said light receiving surface than saidsemiconductor layer, and said tab electrode is bonded to saidtranslucent conductive film through said insulating bonding material.48. A photovoltaic module comprising: a plurality of photovoltaicelements including a first photovoltaic element and a secondphotovoltaic element; and a tab electrode extending in a first directionfor electrically connecting between the first photovoltaic element and asecond photovoltaic element, wherein each of said plurality ofphotovoltaic elements has a photoelectric conversion body and aplurality of finger electrodes extending in a second directiontraversing the tab electrode in plan view formed above saidsemiconductor layers adjacent to a light receiving surface; and formedon a surface of said photoelectric conversion body on a light receivingside of the photoelectric conversion body, said tab electrode isarranged over a region of the surface of said photoelectric conversionbody in which said finger electrodes are formed and a region of thesurface of said photoelectric conversion body in which said fingerelectrodes are not formed, said tab electrode is electrically connectedto said finger electrodes and bonded by a bonding material consisting ofresin without bus bar electrodes on said region of the surface of saidphotoelectric conversion body in which said finger electrodes are notformed, each of the plurality of finger electrodes extending in saidsecond direction intersects the tab electrode extending in said firstdirection in plan view, and are formed on said photoelectric conversionbody; and a conductive adhesive is formed on a first region where saidplurality of finger electrodes traverse the tab electrode, wherein aportion of said finger electrodes arranged at the first region isdirectly bonded on the light receiving surface opposing respective tabelectrode, and a second region other than said first region of the lightreceiving surface opposing respective tab electrode is directly bondedon the tab electrode through said insulating bonding material in planview.
 49. The photovoltaic module according to claim 48, wherein saidtab electrode is bonded by said bonding material consisting of resin tosaid region of the surface of said photoelectric conversion body inwhich said finger electrodes are not formed, between said fingerelectrodes adjacent to each other.
 50. The photovoltaic module accordingto claim 48, wherein said tab electrode is electrically connected tosaid finger electrodes through a solder material.
 51. The photovoltaicmodule according to claim 48, wherein said tab electrode is in directcontact with said finger electrodes.
 52. The photovoltaic moduleaccording to claim 30, wherein each of said plurality of fingerelectrodes has a single line shape in plan view.
 53. The photovoltaicmodule according to claim 30, wherein the plurality of finger electrodesextend in the second direction overlapping the tab electrode and each ofthe plurality of finger electrodes overlaps the tab electrode in planview the conductive adhesive is formed on a first region where saidplurality of finger electrodes overlap the tab electrode, each of thefirst region is in direct contact with the light receiving surfaceopposing respective tab electrode, and each of the second region otherthan said first region in the light receiving surface opposingrespective tab electrode is directly bonded on the tab electrode throughsaid insulating bonding material in plan view.
 54. A photovoltaic modulecomprising: a plurality of photovoltaic elements including a firstphotovoltaic element and a second photovoltaic element, the firstphotovoltaic element and the second photovoltaic element including aplurality of semiconductor layers including a photoelectric conversionlayer and a plurality of finger electrodes for collecting generatedcurrents, formed on said semiconductor layers adjacent to a lightreceiving surface; and a tab electrode extending in a first directionfor electrically connecting between the first photovoltaic element andthe second photovoltaic element, wherein said tab electrode iselectrically connected to said finger electrodes and bonded on saidlight receiving surface through an insulating bonding material withoutbus bar electrodes in a region of said first photovoltaic element wherethe finger electrodes are not formed, said tab electrode is in directcontact with said insulating bonding material, said tab electrode isarranged in a region of a surface of the semiconductor layer on the sideof the light receiving surface in which the finger electrodes are formedand a region of the surface of the semiconductor layer on the side ofthe light receiving surface in which the finger electrodes are notformed, said insulating bonding material bonds the region in which thefinger electrodes are not formed with the tab electrode, and said fingerelectrodes are formed on said semiconductor layers extending in a seconddirection traversing the tab electrode in plan view, each of theplurality of finger electrodes extending in said second directionoverlaps the tab electrode extending in said first direction in planview; and a conductive adhesive is formed on a first region where saidplurality of finger electrodes overlap the tab electrode, wherein aportion of said finger electrode is arranged at the first region isdirectly bonded on the light receiving surface opposing respective tabelectrode, and a second region other than said first region of the lightreceiving surface opposing respective tab electrode is directly bondedon the tab electrode through said insulating bonding material in planview.
 55. The photovoltaic module according to claim 30, wherein each ofthe plurality of finger electrodes intersects the tab electrode in planview.
 56. The photovoltaic module according to claim 54, wherein each ofthe plurality of finger electrodes intersects the tab electrode in planview.
 57. The photovoltaic module according to claim 48, wherein theplurality of finger electrodes are formed on said semiconductor layersadjacent to the light receiving surface.
 58. The photovoltaic moduleaccording to claim 32, wherein said plurality of finger electrodes aredivided into a plurality of groups each including a prescribed number ofsaid finger electrodes, said prescribed number of said finger electrodesincluded in the same said group are so formed that a distance in saidsecond direction between said finger electrodes adjacent in a region inwhich said tab electrode is arranged is smaller than a distance in saidsecond direction between said finger electrodes adjacent in a region inwhich said tab electrode is not arranged.